Micron Technology said it has selected Bechtel to partner on the engineering, procurement and construction (EPC) of the first phase of its memory manufacturing complex in Clay, New York. The factory is planned to become the nation’s largest semiconductor manufacturing facility.
Since breaking ground on its first New York fab in January 2026, Micron has made progress and is now transitioning to the next phase of construction with Bechtel. The project represents one of the largest private investments in New York state history, projected to add approximately $16.7 billion per year in real economic output in the state and approximately $5.4 billion per year in personal income for New Yorkers over the next 30 years.
Micron’s memory manufacturing complex is expected to generate 50,000 jobs in New York, including over 4,500 construction jobs. At peak construction, the work will support thousands of skilled craft professionals, creating opportunities for union trades, apprentices, local training program graduates, specialty contractors, suppliers, and construction professionals across New York. As Micron and Bechtel build out their project team and supply chain, they plan to conduct community outreach to help develop the local supply chain and trade labor ecosystem needed to build these fabs.
Semiconductor fabrication facilities require precision construction across cleanroom systems, ultra-high-purity process infrastructure, advanced electrical systems, vibration-sensitive foundations, and tightly controlled manufacturing environments. Bechtel will deploy an integrated EPC delivery model combining engineering, procurement, advanced digital-enabled construction technologies, modularization strategies, and sophisticated project controls to support schedule confidence, workforce coordination, and operational readiness. The project supports broader efforts to expand U.S. semiconductor manufacturing capacity and strengthen the resilience of America’s technology supply chain.
