Nidec Machine Tool America announced the rebranding of its Additive Manufacturing division to Advanced Manufacturing Technologies.
The newly named division brings three distinct technology platforms under one umbrella:
- LAMDA: metal additive manufacturing system
- ABLASER: high-precision laser micromachining system
- BOND MEISTER: room-temperature wafer bonding machine built for semiconductor and MEMS applications
“This expansion reflects where the industry is heading and where we stand as a company,” Advanced Manufacturing Technologies Sales Manager Tyson Gregory said. “By bringing these specialized systems together, we are making it easier for our North American customers to leverage our full suite of solutions.”
LAMDA – DED AM System
LAMDA is Nidec’s Laser Powder DED Additive Manufacturing system, built for large-scale metal 3D printing. The series, comprising the LAMDA200, LAMDA500, LAMDA2000 and LAMDA5000, features advanced process control with AI anomaly detection for real-time monitoring and feedback.
Additionally, its local shield nozzle allows for the printing of reactive materials without a full inert gas enclosure.
ABLASER – Laser Micromachining System
The ABLASER is built around proprietary optical head technology and a prism rotator. This enables ultra-high precision helical machining, drilling micro-holes down to ⌀27 μm in materials like silicon, SiC and ceramics with no thermal distortion.
Its flexible taper hole control supports straight, forward taper, reverse taper and hand-drum-shaped geometries.
BOND MEISTER – Room Temperature Wafer Bonding Machine
BOND MEISTER joins wafers through surface activation bonding inside a high-vacuum environment with no heat required. This eliminates thermal stress and distortion, allowing for the bonding of dissimilar materials like GaN, GaAs and silicon.
The lineup includes the MWB-04/06-R for research, prototyping and small to medium volume production, MWB-04/06/08-AX for high-throughput production with fully automated cassette-to-cassette operation and MWB-08/12-ST for 300 mm wafer bonding in high-volume applications.
Availability
All three systems are available through Nidec Machine Tool America and backed by the North American sales and service network.
